薄膜機械特性及殘留應力之反算偵測(2/3)
Date Issued
2004-07-31
Date
2004-07-31
Author(s)
吳恩柏
DOI
922212E002009
Abstract
With the rapid trend for miniaturization of
electronic products, new optical techniques are
increasingly needed for measuring the surface
profile or deflection/warpage in the micro-scale
for electronic packages mounted on printed
circuit boards. In this paper, we have
successfully reduced the grating spacing of the
digital projection moiré (DPM) by directing the
grating pattern into a stereo zoom microscope
and performed surface profile measurement
under this microscope. In this method, the
reference grating is generated digitally having
sinusoidal intensity. Another digitally generated
grating is projected into the microscope to form
the object grating. This is via a digital light
processing (DLP) projector and a set of
carefully arranged optical lens. The pitch of
micro-scaled object gratings can be adjusted by
the magnification of the microscope. As a result,
this micro-scaled digital projection moiré
method produces a 5-um pitch micro object
grating and is suitable for surface profile
measurement in a square dimension as small as
50-um. In order to obtain more fringes in each
measurement, the method of linear mismatch is
utilized and the guideline to achieve the
optimal degree of linear mismatch between the
reference and the object gratings is proposed.
In addition, the phase shifting technique is
employed to extract the data between the
recorded fringes. These two procedures
enhanced the measurement resolution to more
than ten folds. Verification of the method is
demonstrated by measuring the inclined plane
of a micro prism. The deviation between the
measured data and the given values is less than
5%. This method is then used to measure the
profile of a solder ball on a flip chip package,
thin film profile measurement.
Subjects
micro digital projection moiré
stereo zoom microscope
linear mismatch
phase shifting
surface profile measurement
Publisher
臺北市：國立臺灣大學應用力學研究所
Type
report
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