Redistribution Layer Routing With Dynamic Via Insertion Under Irregular Via Structures
Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Start Page
1-1
ISSN
0278-0070
1937-4151
Date Issued
2025
Author(s)
Abstract
In modern advanced packaging, redistribution layers (RDLs) are often used for signal transmission among chips, and vias are used for communication among different layers. Most existing RDL routers perform via planning before routing. However, since vias can be placed at arbitrary locations under the irregular via structure, via planning limits the solution space and reduces layout flexibility. This work proposes a new flow with a novel routing graph model for 90- and 135-degree routing, which allows dynamic via insertion during routing. The proposed algorithm enlarges the solution space by providing more choices during path-finding, achieving higher routing quality. The experimental results based on commonly used benchmark suites show that our router achieves shorter wirelength and runtime than state-of-the-art works, including an any-angle router.
SDGs
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Type
journal article