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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Chip-level model of switching noise coupling on integrated system combining package and printed circuit board
Details
Chip-level model of switching noise coupling on integrated system combining package and printed circuit board
Journal
IEEE Int. Symp. Electromagn. Compat. Eur. Workshop
Pages
420-424
Date Issued
2004-09
Author(s)
S.-T. Chen
C.-W. Tsai
S.-M. Wu
C.-P. Hung
TZONG-LIN WU
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/310714
Type
conference paper