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  4. 原子針尖斷層影像儀之半導體元件分析應用
 
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原子針尖斷層影像儀之半導體元件分析應用

Other Title
Applications of Atom Probe Tomography to Semiconductor Devices
Journal
科儀新知
Journal Issue
232
Start Page
59
End Page
70
ISSN
1019-5440
Date Issued
2022-09
Author(s)
顏鴻威  
URI
https://www.airitilibrary.com/Article/Detail?DocID=10195440-202209-202210040016-202210040016-59-70
https://scholars.lib.ntu.edu.tw/handle/123456789/737819
Abstract
原子針尖斷層影像儀(atom probe tomography)是一種state-of-art材料顯微分析技術,能夠解析材料或元件微觀區域的三維原子分佈,它已經被廣泛應用在材料、元件、地質、生物等物質的顯微分析,其獨特的空間解析度與成份偵測極限使它成為當代微縮、複雜、且立體化半導體元件研發所需之關鍵技術。本文提供原子針尖斷層影像儀之簡單介紹,並以實際案例展示它在半導體元件之應用,最後探討此顯微分析技術在半導體領域的挑戰與未來發展,期待提供讀者與半導體領域專家對原子針尖斷層影像儀有更清楚的輪廓與認知。
Atom probe tomography is a state-of-art technique of microscopy and microanalysis, enabling three-dimensional atom distribution of materials and devices. It has been widely applied in the fields of materials, devices, geography and biology and the characterizations of many solids. Its unique spatial resolution and chemical detection limit make atom probe become a critical characterization technique for contemporary devices which are small, complicated and three dimensional. In this article, we provide an introduction to atom probe tomography and further demonstrate some practical cases in semiconductors. Moreover, we address issues on challenges and difficulties of atom probe for applications in future semiconductor. We expect this article is able to make readers and semiconductor experts have clear understanding in atom probe.
Type
journal article

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