A Power Bus with Novel Electromagnetic Bandgap (EBG) Structure for Broadband Noise Isolation: Modeling and Application in RF-SiP
Date Issued
2009
Date
2009
Author(s)
Hsieh, Chia-Yuan
Abstract
A novel EBG power/ground planes using LPC-EBG with multiple via ground surface perturbation lattice (MV-GSPL) is proposed. The proposed structure is used to provide superior stopband to suppress the simultaneous switching noise (SSN) coupling within typical power/ground planes. The MV-GSPL is periodically distributed metal patches shorting to the continuous ground plane and can be embedded in a coplanar type EBG structure to enhance its stopband. This structure is able to provide almost 140 fractional bandwidth without any additional component in a compact unit cell area. An efficient 1-D analysis model is also proposed. The 1-D model is able to consider the via effect of MV-GSPL on the stopband. In the application aspect, a test C-band low noise amplifier (LNA) fabricated by the TSMC 0.18um 1P6M process is packaged on the LPC-EBG with MV-GSPL substrate for noise immunity test. Both the chip-package co-simulation and experimental results show excellent power noise isolation capability of the RF package for the C-band LNA. The proposed EBG structure is confirmed possessing up to 50 % spurious noise reduction in output spectrum of the LNA.
Subjects
simultaneous switching noise(SSN)
Electromagnetic bandgap (EBG)
mixed-signal system
Type
thesis
File(s)![Thumbnail Image]()
Loading...
Name
ntu-98-R96942013-1.pdf
Size
23.32 KB
Format
Adobe PDF
Checksum
(MD5):3b1ae0e6aa4fdd2e5965c470e98aabae