High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure

Journal

Asia-Pacific Symp. Electromagn. Compat.

Pages

117-120

Date Issued

2005-12

Author(s)

H.-C. Kuo

S.-T. Chen

C.-C. Wang

S.-W. Wen

H.-C. Li

C.-C. Chien

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/317869

Type

conference paper