Recrystallization of copper at a solid interface for improved CVD graphene growth

Journal

RSC Advances

Journal Volume

7

Journal Issue

7

Pages

3736-3740

Date Issued

2017

Author(s)

Hsieh, Y.-P.

Chen, D.-R.

Chiang, W.-Y.

Chen, K.-J.

DOI

10.1039/c6ra25750j

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-85010430897&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/399744

Type

journal article