Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: Hydrido-organo siloxane and methyl silsesquioxane

Journal

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Journal Volume

18

Journal Issue

1

Pages

201-207

Date Issued

2000

Author(s)

Yen, Cheng-Tyng

DOI

URI

Type

journal article