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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
TSV-aware analytical placement for 3D IC designs
Details
TSV-aware analytical placement for 3D IC designs
Journal
Design Automation Conference
Pages
664-669
Date Issued
2011
Author(s)
Hsu, M.-K.
Chang, Y.-W.
Balabanov, V.
YAO-WEN CHANG
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-80052663262&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/365142
Type
conference paper