Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate
Journal
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Journal Volume
24
Journal Issue
4
Pages
1724-1727
Date Issued
2006
Date
2006
Author(s)
Abstract
A gasbag pressure (GBP) mechanism has been developed for patterning submicron patterns onto large concave substrate. The GBP mechanism consists of a pressure gasbag and a vacuum chamber system. It provides gradual contact, uniform pressure, and intact contact for imprinting patterns in the soft mold onto a concave substrate. The patterns on the soft mold can be successfully replicated over an entire photoresist-coated concave substrate. The accuracy of replication has been experimentally evaluated. © 2005 American Vacuum Society.
Other Subjects
Molds; Nanotechnology; Photoresistors; Pressure distribution; Pressure regulation; Substrates; Gasbag pressure (GBP); Vacuum technology
Type
journal article
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