Low-frequency damping properties of eutectic Sn-Bi and In-Sn solders
Journal
Scripta Materialia
Journal Volume
64
Journal Issue
8
Pages
757-760
Date Issued
2011
Author(s)
Abstract
Eutectic Sn-Bi and In-Sn solders possess much higher damping capacities than Sn-Ag-Cu solders at temperatures above room temperature. The strain amplitude dependence of damping capacities in Sn-Bi solder determined at room temperature is comparable to that of Mg alloys measured at the same temperature. Sn-Bi and In-Sn solders both exhibit conspicuous high-temperature damping backgrounds, with activation energies of 0.77 and 0.27 eV, respectively. © 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Type
journal article