Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium

Journal

Journal of Alloys and Compounds

Journal Volume

762

Pages

586-597

Date Issued

2018

Author(s)

Yang C.A.

Yang S.

Liu X.

Nishikawa H.

DOI

10.1016/j.jallcom.2018.05.254

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85047432595&doi=10.1016%2fj.jallcom.2018.05.254&partnerID=40&md5=92ebf8d14739608c252e67769a074eff

https://scholars.lib.ntu.edu.tw/handle/123456789/432573

Publisher

Elsevier Ltd

Type

journal article