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  4. Finite Element Analysis and Accelerated Life Tests of Electronic Packaging under Temperature Cycling Loading
 
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Finite Element Analysis and Accelerated Life Tests of Electronic Packaging under Temperature Cycling Loading

Date Issued
2014
Date
2014
Author(s)
Lu, Yi-An
URI
http://ntur.lib.ntu.edu.tw//handle/246246/263301
Abstract
The reliability and fatigue life of electronic packages are of a major concern to engineers. Traditional prediction approaches include numerical methods such as the finite element method (FEM) and experimental methods such as accelerated life testing (ALT). FEM, used mainly by design engineers, aims to predict the fatigue life of a package by observing physical processes that lead to failure. On the other hand, ALT is usually carried out by reliability or quality engineers to correlate the fatigue life of an electronic assembly under different environmental conditions in the form of acceleration factors (AF). This study bridges the gap between two types of engineers and presents an efficient and cost effective way of fatigue life prediction. Previous studies are mostly of a deterministic nature, neglecting the variation of dimension and material properties that are present in real life. By introducing parameter uncertainties into FEM modeling, this study uses FEM as a substitute for ALT experiments, giving the possibility of performing a large number of tests for a more accurate AF model without the experimental cost. An FEM model of the plastic ball grid array (PBGA) with 316 solder balls is constructed and verified against literature data. The model is then used for both deterministic (traditional) and probabilistic analyses (the proposed method), the results of which are used to devise its respective AF models. The study shows that the probabilistic approach is a great improvement over its deterministic counterpart, with better accuracy and a wider range of use. The effects of parameter variation are discussed, with the height of the BT Substrate being of the most importance. The life distribution of each of the 6 test conditions are also investigated, with an attempt at prediction of the statistical terms such as standard deviation and Weibull parameters, which shows promising results.
Subjects
有限元素分析
加速測驗
電子封裝體
參數不確定性
Type
thesis
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