Electrical Characteristics of Via Discontinuity and Compensation Design
Date Issued
2007
Date
2007
Author(s)
Chian, Wei-Ning
DOI
zh-TW
Abstract
In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. As the data rates increase up to several GHz, it is essential to consider the significant impact of vias on signal integrity of high-speed digital systems. Usually, it is found to be capacitive and would cause a voltage drop in the time-domain reflectometry (TDR) waveform.
To reduce this reflection noise, this thesis describes a systematic design procedure to improve the electrical performance of multilayer through-hole via transitions by using the high-impedance interconnects. In addition to the thinner transmission line, a novel matching structure is proposed by changing the anti-pad shape from circular to capsular to achieve the better broadband matching condition. The compensation method also applies to a differential via transition successfully. To make the design of compensation more complete, a way of combining two compensation methods applies to the via stub structures. This method is demonstrated by the time-domain simulation and measurements, accordingly.
Subjects
連通柱
開路殘段
膠囊狀清潔環
via
via stub
capsule-shaped anti-pad
Type
thesis
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