Curvature Radius and layer stresses for thermal strain in semiconductor multilayer structures

Resource

Chinese J. of semicond.,4,171-180.

Journal

Chinese J. of semicond

Journal Issue

4

Pages

171-180

Date Issued

1983-01

Date

1983-01

Author(s)

Feng &amp, Z.C.

Liu, H.D.

URI

Type

journal article