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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
A 32×32 temperature and tactile sensing array using PI-copper films
Details
A 32×32 temperature and tactile sensing array using PI-copper films
Journal
International Journal of Advanced Menufacturing Technology
Journal Volume
46
Pages
945-956
Date Issued
2009
Author(s)
Y.-J. Yang
M.-Y. Cheng
S.-C. Shih
X.-H. Huang
C.-M. Tsao
F.-Y. Chang
K.-C. Fan
YAO-JOE YANG
DOI
10.1007/s00170-009-1940-z
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/587881
https://www.scopus.com/inward/record.uri?eid=2-s2.0-77349126638&doi=10.1007%2fs00170-009-1940-z&partnerID=40&md5=cb821e0fc2b8092f9c4ae7cccbcbd924
SDGs
[SDGs]SDG7
Type
journal article