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  4. An integrated flexible temperature and tactile sensing array using PI-copper films
 
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An integrated flexible temperature and tactile sensing array using PI-copper films

Journal
Sensors and Actuators, A: Physical
Journal Volume
143
Journal Issue
1
Pages
143-153
Date Issued
2008
Author(s)
YAO-JOE YANG  
Cheng, M.-Y.
Chang, W.-Y.
Tsao, L.-C.
Yang, S.-A.
WEN-PIN SHIH   
Chang, F.-Y.
Chang, S.-H.
Fan, K.-C.
DOI
10.1016/j.sna.2007.10.077
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/448543
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-40949135130&doi=10.1016%2fj.sna.2007.10.077&partnerID=40&md5=c718c7d834d0000a43d829a894735b25
Abstract
This paper presents the design, fabrication and measurement of a flexible 8 × 8 temperature and tactile sensing array which will be used as the artificial skin for robot applications. The temperature and tactile sensing elements are heterogeneously integrated on a flexible copper-PI film using micromachining techniques. The tactile sensing elements are formed by dispensing conductive polymer on the pre-defined interdigital copper electrodes. This novel fabrication method can effectively reduce the crosstalk between each sensing element. The strategy and the verification for reducing crosstalk currents are described. The mechanical and electrical properties of tactile sensing elements are measured. Also, discrete temperature sensor chips are employed as the temperature-sensing cells. Scanning circuits are implemented. Finally, measured temperature and tactile images have been successfully obtained by using the integrated 8 × 8 sensing arrays. The flexible sensor arrays are bendable down to a 4-mm radius without any degradation in functionality. © 2007 Elsevier B.V. All rights reserved.
SDGs

[SDGs]SDG7

Type
journal article

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