Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Fatigue Life and Reliability Analysis of Electronic Packages under Thermal Cycling and Moisture Conditions
Details
Fatigue Life and Reliability Analysis of Electronic Packages under Thermal Cycling and Moisture Conditions
Journal
Institute of Industrial Engineers Asian Conference
Date Issued
2013
Author(s)
Hsu, Y.
Wu, W.F.
Hsu, C.M.
2013
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415552
Type
conference paper