quantitative reliability analysis of drop impact testing for electronic packages
Date Issued
2006
Date
2006
Author(s)
Chen, Shau-Jei
DOI
zh-TW
Abstract
From reliability engineering point of view, present study investigates the effect of solder ball size and parametical values of life prediction model on the impact life of electronic packages. First, finite element analysis is employed to find the maximum stress of an electronic package subjected to a JEDEC prescribed acceleration input. The input is resembled to what will really happen in a drop test. The drop impact life of the package is then evaluated based on an empirical formula that relates the calculated stress to the life. The effect of probability variation of solder ball size on the impact life of the package as well as its reliability is discussed in particular. In the second phase of the study, the parametrical values used in the drop life prediction model are discussed in detail, also from probability point of view. Through considering their probability variations, the predicted impact lives also appear in a probabilistic manner which, in turn, reflects the quantitative reliabilities of the package. It is found that all factors studied in this thesis affect the impact life of the package and its reliability to certain degrees. Among them, the influence of model parameters may be the greatest if their variations are large enough.
Subjects
可靠度
電子封裝
掉落衝擊壽命
reliability
electronic package
drop impact life
Type
thesis