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College of Electrical Engineering and Computer Science / 電機資訊學院
Communication Engineering / 電信工程學研究所
Late Breaking Results: Warpage-Aware Generative Floorplanning for Reliable Advanced Packaging
Details
Late Breaking Results: Warpage-Aware Generative Floorplanning for Reliable Advanced Packaging
Journal
2025 62nd ACM/IEEE Design Automation Conference (DAC)
Start Page
1-2
Date Issued
2025-06-22
Author(s)
Chen, Min-Hung
Li, Cheng-Yen
Su, Chuan-Chi
YAO-WEN CHANG
Chen, Tung-Chieh
DOI
10.1109/dac63849.2025.11132923
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/733045
Publisher
IEEE
Type
conference paper