Investigation of Vapor Compression Cooling System for Electronic Elements
Date Issued
2007
Date
2007
Author(s)
Yu, Jin-Ruei
DOI
zh-TW
Abstract
The cooling of high power components in electronic products is uniquely challenging due to the increasing power in a narrow area. As a result, more powerful and efficient thermal solutions may be required in order to achieve higher power dissipation.
This dissertation experimentally investigates the thermal performances of the vapor compression cooling system（VCCS）for electronic elements. The VCCS includes a compressor, condenser, expansion valve , and two evaporators. All of these components are designed for a vapor compression cycle with R-134a as the working fluid. Especially the two evaporators were simulated to dissipate the heat generated from CPU and GPU respectively. A complete system was built and tested in order to determine overall system feasibility and performance.
Experimental results obtained with the prototype system demonstrate its feasibility and performance for use in cooling compact electronic devices. The cooling capacity of the VCCS investigated varied from 275W to 375W, with a COP of 1.9 to 2.4, at pressure ratios of 1.9 to 2.8. The thermal resistance of the evaporator was ranged from 0.12 to 0.21 oC/W. Finally, in order to avoid the destruction of the electronic devices, this research adopts dynamic fan speed to control the temperature of the heat source, which is varid from 1500 to 1725rpm.
Subjects
蒸氣壓縮循環
電子散熱
溫度控制
冷凍能力
Vapor compression cycle
Electronic cooling
Temperature control
Cooling capacity
Type
thesis
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