Cross-interaction of UBM and soldering pad in flip-chip solder joints
Resource
Journal of Electronic Materials,33(12),1424-1428.
Journal
Journal of Electronic Materials
Journal Volume
33
Journal Issue
12
Pages
1424-1428
Date Issued
2004-12
Date
2004-12
Author(s)
Tsai, C. M.
Luo, W. C.
Chang, C. W.
Shieh, Y. C.
Kao, and C. R.
Type
journal article