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  4. Large‐Area Lithium Electroplating on Copper Foil
 
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Large‐Area Lithium Electroplating on Copper Foil

Journal
Advanced Materials Technologies
ISSN
2365-709X
2365-709X
Date Issued
2024-06
Author(s)
Yao‐Xian Wang
Shih‐Kuan Hong
Hsiao‐Ping Hsu
CHUNG-WEN LAN  
DOI
10.1002/admt.202400116
DOI
10.1002/admt.202400116
URI
https://www.scopus.com/record/display.uri?eid=2-s2.0-85194552977&origin=resultslist
https://scholars.lib.ntu.edu.tw/handle/123456789/719678
Abstract
Anode-free lithium metal batteries have attracted much attention due to their high energy density and lack of excess Li. In this work, Li film is deposited on large-area copper foil (64 cm2) with good uniformity by a self-designed electroplating device that quickly assembles and can be operated outside the glove box. By adding the high concentration of LiNO3 into the lithium bis(trifluoromethylsulfonyl)azanide (LiTFSI)-based electrolyte, the high Li+ conductive solid electrolyte interface (SEI) layer regulated the Li+ flux, forming the columnar structure at a high current density of 40 mA cm−2, and compact morphology at 60 mA cm−2. Even at 100 mA cm−2, Li film on copper foil (Li@Cu) maintains its macroscopic uniformity. Furthermore, electrolytes, additives, and temperature are further optimized. The symmetric Li@Cu || Li cell cycle life can extend to 80 cycles. This work provides essential information for future manufacturing processes and scale-up.
Subjects
columnar Li Structure
high current density
high Li+ conductive SEI layer
lithium
thin films
Publisher
Wiley
Type
journal article

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