Electromigration in flip chip solder joints under extra high current density

Resource

Journal of Applied Physics, 107(7), 073516

Journal

Journal of Applied Physics

Pages

73516

Date Issued

2010

Date

2010

Author(s)

Lin, Y.W.

Ke, J.H.

Chuang, H.Y.

Lai, Y.S.

DOI

URI

SDGs

[SDGs]SDG7

Type

journal article

File(s)

Name

346.pdf

Size

23.42 KB

Format

Adobe PDF

Checksum

(MD5):1120b811aa0e655e67941c8f77408f98