Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer

Resource

Journal of electronic materials, 39(12), 2662-2668

Journal

Journal of electronic materials

Journal Volume

39

Journal Issue

12

Pages

2662-2668

Date Issued

2010

Date

2010

Author(s)

Chung, H.Y.

Lai, Y.S.

DOI

URI

Type

journal article

File(s)

Name

269.pdf

Size

23.41 KB

Format

Adobe PDF

Checksum

(MD5):2533c57e5e70551fa97ee5204b2ce177