Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer
Resource
Journal of electronic materials, 39(12), 2662-2668
Journal
Journal of electronic materials
Journal Volume
39
Journal Issue
12
Pages
2662-2668
Date Issued
2010
Date
2010
Author(s)
Abstract
Ni/95Pb-5Sn/Cu ternary diffusion couples were used to investigate the cross-interaction between Ni and Cu across a layer of 95Pb-5Sn solder. High-lead solder layers with a thickness of 100 μm or 400 μm were electroplated over Cu foils. A pure Ni layer (20 μm) was then deposited over the as-deposited high-lead solder surface. The diffusion couples were then aged at 150°C to 250°C for different periods of time. With this technique, the diffusion couples were assembled without experiencing any high-temperature process such as reflow, which would have accelerated the interaction and caused difficulties in analysis. This study revealed that massive spalling also occurred during aging even though reflow was not used. The massive spalling began with the formation of microvoids. When the microvoids had congregated into large enough voids, intermetallic compounds (Cu 3Sn) started to spall from the interface. This spalling phenomenon occurred sooner with increasing temperature and decreasing solder volume. © 2010 TMS.
Type
journal article
File(s)![Thumbnail Image]()
Loading...
Name
269.pdf
Size
23.41 KB
Format
Adobe PDF
Checksum
(MD5):2533c57e5e70551fa97ee5204b2ce177