Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Effect of Parametric Randomness on the Reliability Analysis of Electronic Packages
Details
Effect of Parametric Randomness on the Reliability Analysis of Electronic Packages
Journal
7th International Congress on Thermal Stresses
Pages
pp. 131-134
Date Issued
2007
Author(s)
Wu, W. F.
Tsai, K.J.
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/415551
Type
conference paper