Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads

Resource

Journal of Alloys and Compounds, 491(1-2), 610-617

Journal

Journal of Alloys and Compounds

Journal Volume

491

Journal Issue

1-2

Pages

610-617

Date Issued

2010

Date

2010

Author(s)

Shiue, Yu-Yun

DOI

URI

Type

journal article

File(s)

Name

370.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):69068245d4ef33a74fa318d8678a8716