Effect of La addition on the interfacial intermetallics and bonding strengths of Sn-58Bi solder joints with Au/Ni/Cu pads
Resource
Journal of Alloys and Compounds, 491(1-2), 610-617
Journal
Journal of Alloys and Compounds
Journal Volume
491
Journal Issue
1-2
Pages
610-617
Date Issued
2010
Date
2010
Author(s)
Shiue, Yu-Yun
Type
journal article
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Name
370.pdf
Size
23.45 KB
Format
Adobe PDF
Checksum
(MD5):69068245d4ef33a74fa318d8678a8716