Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

Resource

Journal of Electronic Materials 35 (2): 310-318

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

2

Pages

310-318

Date Issued

2006

Date

2006

Author(s)

Yen, Shiu-Fang

Wu, Hui-Min

URI

Type

journal article

File(s)

Name

95.pdf

Size

765.14 KB

Format

Adobe PDF

Checksum

(MD5):bd9e7333d30f3037b6c42ae087de1b16