Publication: Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples
cris.lastimport.scopus | 2025-05-09T22:40:42Z | |
cris.virtual.department | Materials Science and Engineering | en_US |
cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
cris.virtualsource.department | 7a16da9c-7b97-4621-b189-0e11d96cd673 | |
cris.virtualsource.orcid | 7a16da9c-7b97-4621-b189-0e11d96cd673 | |
dc.contributor.author | Wang Y.W. | en_US |
dc.contributor.author | Zhu Z.X. | en_US |
dc.contributor.author | Shih W.L. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Shih W.L.;Zhu Z.X.;Wang Y.W. | |
dc.date.accessioned | 2019-11-27T02:02:11Z | |
dc.date.available | 2019-11-27T02:02:11Z | |
dc.date.issued | 2019 | |
dc.identifier.doi | 10.1016/j.jallcom.2019.05.328 | |
dc.identifier.issn | 09258388 | |
dc.identifier.scopus | 2-s2.0-85066604103 | |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85066604103&doi=10.1016%2fj.jallcom.2019.05.328&partnerID=40&md5=328c148088abbff9de65ce1522b289ad | |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432559 | |
dc.publisher | Elsevier Ltd | |
dc.relation.ispartof | Journal of Alloys and Compounds | |
dc.relation.journalvolume | 799 | |
dc.relation.pages | 108-112 | |
dc.title | Abnormal Cu3Sn growth through grain boundary penetration in space-confined Ni-Sn-Cu diffusion couples | en_US |
dc.type | journal article | en |
dspace.entity.type | Publication |