A Study of Droplet Evaporation on Substrates by Different Cleaning Methods
Date Issued
2005
Date
2005
Author(s)
Kao, Chih-Po
DOI
zh-TW
Abstract
Droplet evaporation is a basic natural phenomena, and has a lot of applications. In many experiment procures, reside effects the result. Therefore, it is important to know how to control distribution of particles in industry or in research.
There are two main parts in this journal, the first one is the substrate cleaning and the second is droplet evaporation. We improve there are two distinct behaviors on different cleaning substrates when evaporating. When droplet evaporates on unclean or wet clean substrate, the droplet pins with bad repeatability; on the other hand, dry clean gets unpin type with repeatability. It also be found on hydrophobic substrates.
Besides, pining is relative to particle concentration. When particle concentration is more than 5×10-3%, the unpin droplet is pinned on cleaning substrates. Concentration increases, terminal area shrink velocity at the same pressure increases, too; under the same concentration, terminal area shrink velocity at 0.4 atm is triple that at 1atm.
Subjects
液滴蒸發
基板清洗
粒子濃度
環境壓力
Droplet evaporation
Substrate cleaning
Particle concentration
Pressure
Type
thesis
File(s)![Thumbnail Image]()
Loading...
Name
ntu-94-R92543061-1.pdf
Size
23.53 KB
Format
Adobe PDF
Checksum
(MD5):73b84ab6a9dd3361a7fc663dd98a0c10