Laser Micro-machining on Engeering Materials
Date Issued
2006
Date
2006
Author(s)
Huang, Hsin-Yi
DOI
zh-TW
Abstract
The 21st century is high-tech generation with products containing various kinds of micro-structures and micro-components. With the development of associated manufacturing technology, the industry needs, in many occasions, to carry out the processing of micro-structure on brittle materials. The use of chemistry-etching has the advantage on high accuracy, but its process is complex and has low efficiency. Now the trend is to attempt use of the laser machining to replace the conventional ways.
The material removal by laser micro-machining have two kinds: photothermal and photochemical mechanisms. The processing via photochemical mechanism moves materials in a way that photons break the chemical bonds of the material directly without the high temperatures accompanied, and the machining accuracy will be much higher than that via photothermal mechanism. The femtosecond laser has a characteristic of extremely short pulse, whose working mechanism falls to photochemical category. The research on femtosecond laser applications has not been widely carried out at present, but showing great potentiality. In order to grasp its characteristics, this research was planned on the fundamental investigation and comparison was made with the Nd:YVO4 laser resualts which widely applied in industry.
Subjects
飛秒雷射加工
Nd：YVO4雷射加工
Femtosecond laser machining
Nd:YVO4 laser machining
Type
thesis
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