Joint Exploration of Architectural and Physical Design Spaces with Thermal Consideration
Date Issued
2005
Date
2005
Author(s)
Wu, Yen-Wei
DOI
en-US
Abstract
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is a®ected by both the power consumption of processor components and the chip layout. Therefore, for thermal-aware design it is crucial to consider the thermal e®ects of di®erent °oorplans during micro-architectural design space exploration. In this thesis, I propose a thermal-aware architectural °oorplanning framework. With the aid of this framework, an architect can explore both physical and architectural design spaces simultaneously to ‾nd an architecture and the corresponding chip layout that optimizes performance under a thermal limitation.
Subjects
溫度
效能
計算機結構
Thermal
Performance
Architecture
Type
thesis
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