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College of Electrical Engineering and Computer Science / 電機資訊學院
Communication Engineering / 電信工程學研究所
Thermal conduction analysis on microwave IC packages
Details
Thermal conduction analysis on microwave IC packages
Journal
URSI Radio Science Meeting
Date Issued
1998-06
Author(s)
J.-F. Kiang
S.-P. Liu
W.-T. Lo
JEAN-FU KIANG
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/342911
Type
conference paper