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College of Electrical Engineering and Computer Science / 電機資訊學院
Photonics and Optoelectronics / 光電工程學研究所
Employing an Out-of-Plane Coupling Model for Optical Sub-Assembly Packaging Applications
Details
Employing an Out-of-Plane Coupling Model for Optical Sub-Assembly Packaging Applications
Journal
SPIE
Pages
306-310
Date Issued
1998-01
Author(s)
W. T. Chen
L. A. Wang
LON A. WANG
DOI
10.1117/12.312866
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/342853
SDGs
[SDGs]SDG7
Type
conference paper
