Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes

Journal

Journal of Materials Engineering and Performance

Journal Volume

18

Journal Issue

8

Pages

1133-1139

Date Issued

2009

Author(s)

Chuang, T.H.

Jain, C.C.

Wang, S.S.

TUNG-HAN CHUANG

DOI

10.1007/s11665-008-9344-z

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491994

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84864008751&doi=10.1007%2fs11665-008-9344-z&partnerID=40&md5=68910e4d5de62af29ce5bf8ebe076160

Type

journal article