Routing for manufacturability and reliability
Journal
IEEE Circuits and Systems Magazine
Journal Volume
9
Journal Issue
3
Pages
20-31
Date Issued
2009
Author(s)
Chen, H.-Y.
Abstract
As IC process geometries scale down to the nanometer territory, industry faces severe challenges of manufacturing limitations. To guarantee high yield and reliability, routing for manufacturability and reliability has played a pivotal role in resolution and thus yield enhancement for the imperfect manufacturing process. In this article, we introduce major routing challenges arising from nanometer process, survey key existing techniques for handling the challenges, and provide some future research directions in routing for manufacturability and reliability. © 2006 IEEE.
SDGs
Type
journal article