Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Journal

Journal of Alloys and Compounds

Journal Volume

478

Journal Issue

1-2

Pages

L1-L4

Date Issued

2009

Author(s)

Wang Y.W.

DOI

10.1016/j.jallcom.2008.11.027

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-67349152353&doi=10.1016%2fj.jallcom.2008.11.027&partnerID=40&md5=fd739057e2ac7f7014baaa25c84209d6

https://scholars.lib.ntu.edu.tw/handle/123456789/432678

Publisher

Elsevier BV

Type

letter