Analysis and measurement of an intra-chip or inter-chip global interconnect by using LTCC manufacturing process
Date Issued
2006
Date
2006
Author(s)
Lin, Kun-Chih
DOI
en-US
Abstract
This thesis is based on the concept of the System in Package to solve the problem of transmission of intra-chip or inter-chip global interconnect by using the LTCC (low temperature co-fired ceramic) process. By using the multilayer structure of LTCC, the chip designer can easily design the transmission line with characteristic impedance he needs. He can also get a better transmission efficiency and low power consumption because of lower attenuation constant and higher phase velocity compared with the narrow metal on chip in low frequency of the on package transmission line.
Subjects
低溫共燒陶瓷
廣域連結
LTCC
global interconnect
Type
thesis
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