Study on the Countercurrent and Cocurrent Multistage Operations of Ozonation Process (Ⅱ). Part 1: Application of Ozone with or without Ultraviolet for the Treatment of Waste Bright Copper Plating Bath.
Date Issued
2000-07-31
Date
2000-07-31
Author(s)
張慶源
DOI
892211E002025
Abstract
The objective of this study is to remove
polyethylene glycol (PEG) from the acidbased
electroplating solution of printed
wiring board (PWB) industry by ozone (O3)
or ozone/ultraviolet (UV) processes. The
substrates (the major chemical species) of the
electroplating solution recipe are inorganics,
such as sulfuric acid, copper sulfate, etc.
Ozonation mainly destroys the minor organic
additives (PEG, for example).
The study establishes the kinetic expressions of the ozone self-decomposition
reactions in the electroplating solution
substrate with and without UV radiation by
semi-batch experiments. In O3/PEG or
O3/UV/PEG reactions, the reaction kinetics
may be simulated by a two-step reaction
mechanism in terms of O3 and total organic
carbon (TOC).
Subjects
Ozone
polyethylene glycol
electroplating solution
total organic carbons
Publisher
臺北市：國立臺灣大學環境工程學研究所
Type
report
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