An equation-based circuit model and its generation tool for 3-D IC power delivery networks with an emphasis on coupling effect
Journal
IEEE Trans. Components, Packaging and Manufacturing Technology
Journal Volume
4
Journal Issue
6
Date Issued
2014
Author(s)
Abstract
In this paper, a methodology to characterize the electrical behaviors of power delivery networks (PDNs) in 3-D integrated circuits is presented. An automation tool is developed to effectively construct SPICE compatible equivalent circuit models of target PDNs. The core of the tool consists of three equation-based algorithms, which not only model the planar PDN and through-silicon vias in detail, but also the interactions between them through the silicon surface. Simulation results from the proposed SPICE model are in close agreement with the ones obtained from the full-wave simulator up to 40 GHz with more than 100 times speedup. © 2014 IEEE.
SDGs
Type
journal article