The critical oxide thickness for Pb-free reflow soldering on Cu substrate

Resource

Thin Solid Films, 520(16), 5346-5352

Journal

Thin Solid Films

Pages

5346-5352

Date Issued

2012

Date

2012

Author(s)

Chung, C.Key

Chen, Y.J.

Li, C.C.

DOI

URI

Type

journal article

File(s)

Name

24.pdf

Size

23.44 KB

Format

Adobe PDF

Checksum

(MD5):b985358a5cef993e0941135d4df47a11