Full wave characterization of a through hole via

Journal

1993 IEEE Electrical Performance of Electronic Packaging

Pages

185-188

Date Issued

1993

Author(s)

Hsu, Show-Gwo

DOI

10.1109/EPEP.1993.394558

URI

http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910032376/1/00394558.pdf

Type

conference paper

File(s)

Name

00394558.pdf

Size

245.25 KB

Format

Adobe PDF

Checksum

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