We studied the atomic layer deposition (ALD) processes of two polyamide films and their applications in flexible gas-permeation barriers. The two polyamides were: (1) poly-N-(2-aminoethyl)-3-oxopropanamide (PA32), deposited from malonyl chloride and ethylene diamide, and (2) poly-(E)-N-(2-aminoethyl)-4-oxobut-2-enamide (PA42),
deposited from fumaryl chloride and ethylene diamide. The polyamide films showed ALD process temperature of 75~125
