Electromechanical behavior of the curled cantilever beam
Journal
Journal of Micro/Nanolithography, MEMS, and MOEMS
Journal Volume
8
Journal Issue
3
Date Issued
2009
Author(s)
Lin, Quei Yen
Chuang, Wan-Chun
Tsai, Yi-Lin
Hu, Yuh-Chung
Lee, Chi-Yuan
Liu, Ming-Che
Lin, Wei-Cheng
Hsueh, Po-Ren
Liaw, Shwu-Jen
Abstract
We propose an approximate analytical solution to the pull-in voltage of a microcurled cantilever beam. The analytical model considers the realistic situations, which include stress gradient, nonideal boundary conditions, and fringing field capacitance. The proposed analytical model can be used at wafer level for extracting the Young's modulus of the thin film of which the cantilever beam is made. The approximate analytical solution is obtained based on the Euler's beam model and the minimum energy method. The accuracy of the proposed model is verified to be more accurate than the other published models. The model presented in this work can be used for wafer-level evaluation of the material properties through simple electrical testing and is also expected to find use in the design of microelectromechanical devices. © 2009 Society of Photo-Optical Instrumentation Engineers.
SDGs
Type
journal article