Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder
Journal
2024 International Conference on Electronics Packaging, ICEP 2024
Start Page
203
End Page
204
ISBN (of the container)
9784991191176
ISBN
9784991191176
Date Issued
2024-01-01
Author(s)
DOI
10.23919/ICEP61562.2024.10535667
Abstract
In order to minimize the energy consumption and thermal warpage during reflow process, low-temperature solder have become a hot research area in recent years. In this study, Sn-Bi system was chosen as the starting point for the study of low-temperature solders. By increasing the proportion of Sn and adding additional elements in Sn-Bi solder, it was expected that the melting point will be lowered and the mechanical properties will be improved at the same time. Then, influence of Sb addition on Sn-Bi solder grain refinement before and after thermal aging was investigated. Finally, several properties of different additional elements, including melting point, interfacial reaction, wettability and microstructure evolution were investigated.
Event(s)
23rd International Conference on Electronics Packaging, ICEP 2024, Toyama, 17 April 2024 through 20 April 2024, Code 199866
Subjects
Interfacial reaction
Low-temperature solder
Microstructure
Sn-Bi solder
Wettability
Type
conference paper