Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness

Resource

Journal of Electronic Materials 36 (11): 1455-1461

Journal

Journal of Electronic Materials

Journal Volume

36

Journal Issue

11

Pages

1455-1461

Date Issued

2007

Date

2007

Author(s)

Chang, Chien Wei

Yang, Su Chun

Tu, Chun-Te

URI

Type

journal article

File(s)

Name

07.pdf

Size

546.54 KB

Format

Adobe PDF

Checksum

(MD5):490f6da0ecb183093d338f1bc09463b3