Investigation of Shock-Resistant Ignition Chips
Date Issued
2008
Date
2008
Author(s)
Chiu, Min-Han
Abstract
An electro-explosive device can provide high initiating power to trigger energetic materials in a fast rate. They are widely utilized in automobile, aeronautics, space, and defense industries.n this thesis, planar bridge structures of novel electric-explosive devices were investigated to improve over conventional metal bridge wires. The solid ignition chips were fabricated via micro-electro-mechanical system (MEMS) technologies. Gold (Au) bridges were deposited and patterned on the oxide layer of a silicon wafer. These thin- film ignition chips can be integrated as excellent electro-actuating devices capable of initiating energetic materials with exceptional features of fast response, low initiating energy, high stability, and high shock resistance. The design and manufacture of the Au ignition chips were based on numerical simulations of the metal bridges undergoing electric-thermal heating processes. Afterward, a shaped layer of Zirconium (Zr) was overlaid on the Au bridge to form a reactive ignition chip.n order to elucidate the igniting performances of the inert Au and reactive Au/Zr metal bridges, both thin-film chips were successively activated by an electric igniting circuit with a 33μF capacitor charged to 33.5 V. In addition to monitoring the voltage across the bridge during actuating, a photodiode was simultaneously used to detect the radiative intensity of the bridge under activation. Both signals evidence scenarios of temperature rising, phase changes, and percussion of the bridge reactions. The two types of the solid igniters were then employed to trigger a small amount of reactant powder Zr/KClO4 according to MIL-STD-1512 regulation overlaid on each of the bridges with satisfactory success. The exothermic reaction of Zr/KClO4 powder was confirmed by a high-speed CCD camera imaged at 2000 frames/sec. The experimental results reveal that the reacting time for the Au/Zr bridge is 1.7
Subjects
igniting chip
solid bridge
reactant layer
shock response
high G impact apparatus
Type
thesis
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