Studies on UV-curable conductive materials for EMI shielding
Date Issued
2006
Date
2006
Author(s)
Ko, Fu-Sheng
DOI
zh-TW
Abstract
本研究是以製作具有導電度並且可微影的電磁波屏蔽材料。採用的兩種方式;方法一將微米級之銀粉以不同比例與紫外光可硬化樹脂摻，並混塗佈於PET薄膜作成具有電磁波屏蔽效果之薄膜。方法二使用表面改質技術將表面接支成具有的特殊官能基(-SH)，再利用自組裝方式將銀還原吸附於表面而得奈米銀薄膜。方法一的製作過程需要克服的問題為如何使銀粉分散於環氧丙烯酸脂基材中。本研究中先以機械攪拌的方式將不同比例的環氧壓克力樹脂加入不同量的銀粉經由球磨混鍊機將銀粉均勻分散於樹脂中，將所得到的銀膠塗佈於PET薄膜上。當銀粉在樹脂中的含量為72%時可得到表面電阻約1.162Ω/cm2之薄膜。而於方法二的製作過程需確認表面是否經過改質而使其具有吸咐銀粒子的官能基(-SH)。使用自組裝所製得的導電薄膜其表面電阻約為0.799Ω/cm2。改變光罩圖案後經不同製程可製備出不同的導電線路，觀察其電磁波屏蔽的效果。
Two synthesis methods of conductive materials were developed in EMI shielding field. The first one was prepared by the blending of silver and epoxy acrylate at different ratios. Via the lithography process, the various silver contents of conductive resin films were cured by UV-light on the PET film. The lowest surface resistance of 1.162Ω/cm2.was achieved via the method. The second conductive material was based on the self-assembly method to develop a conductive film. The colloidal silver was self-assembling onto the silane-modified surface through the –SH group of the MPS, and the adhesive force between the glass microscope slide and silver could be improved obviously. The lowest surface resistance of 0.799Ω/cm2 was achieved via the method.Two kinds of conductive materials were transfer to various pattern forms and the EMI properties of each pattern films were investigated.
Subjects
紫外光可硬化
導電膠
自組裝
電磁波屏蔽
UV-curable
conductive paste
self-assembly
EMI shielding effectiveness
Type
thesis
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