Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad

Resource

Journal of Electronic Materials 33 (1): 34-39

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

1

Pages

34-39

Date Issued

2004

Date

2004

Author(s)

Chiang, M. J.

Chang, S. Y.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

85.pdf

Size

364.91 KB

Format

Adobe PDF

Checksum

(MD5):5b4ccec5e62a42a3f3c69c40ce6825fa