Application of Microcontact Printing for the Fabrication of Micrometer-scale and Sub-micrometer-scale Silver and Copper Patterns & Conducting Polymer Polyaniline Patterns
Date Issued
2007
Date
2007
Author(s)
Hsu, Chio-Hao
DOI
en-US
Abstract
Microcontact printing (μCP) and electroless plating are combined to produce micro-scale patterns of silver and copper on glass substrates. We fabricate copper and silver line patterns with feature sizes of 0.6~10 μm in length and separated by 0.6~10 μm by using two methods: (1) The printing seeding layer (PSL) method is to apply μCP to directly print the surface-active reagent pattern for further electroless plating. (2) The printing masking layer (PML) method is to use μCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates. We discuss the relation between the surface roughness and the adhesion property of copper and silver film. We use sol-gel process to increase the surface roughness. We also use the oxygen plasma pretreatment to increase the SAM quality, and to simplify the experimental procedure.
Conducting polymer polyaniline pattern is fabricated by the printing masking layer (PML) method with feature sizes of 10 μm lines and separated by 10 μm. We discuss the conductivity of polyaniline film at different stretching conditions.
Subjects
微觸印刷
無電電鍍
直接蓋印法
蓋印遮護層法
溶膠凝膠法
化學沉積法
microcontact printing
electroless plating
printing seeding layer
printing masking layer
sol-gel process
chemical deposition
Type
thesis
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